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Intel is proposing a three-board modular framework for modular laptops and PCs


bonami2

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Gurpreet Sandhu, Vice President, Platform Engineering Group, Reshma PP, Director System Design, Platform Engineering Group and Roberta Zouain, Sustainability Product Strategy & Marketing Manager, Client Segments have detailed a three board laptop design that maximizes PCB Panel utilization, reduces PCB waste and supports different system configurations with minimal modifications. This supports standardised modules like M.2 SSDs and Core Board, users can effortlessly enhance their storage, and upgrade the system with next-generation processors.

The modular design streamlines the repair process and contributes to the right-to-repair initiative allowing for the replacement of specific damaged parts and IO without the need to discard the entire motherboard. The creation of universal I/O boards (left and right I/O boards) that can be used across various platforms or market segments, which includes all types of laptops but also desktop PCs.

WWW.EENEWSEUROPE.COM

Intel is proposing a three-board modular framework for modular laptops and PCs using the Thunderbolt protocol over USB-C connectors.

 

 

 

 

 

Framework here as an example :

 

 

 

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CPU: Intel G7400 @5.2GHZ 4.2Ring 1.3Vcore
MOTHERBOARD: MSI MPG Z790i Edge
RAM: 2x64GB Crucial 128GB @5600
CASE: Jonsbo N1 Mini ITX
HDD: 8TB + 4TB HDD + some nvme
GPU: Intel Arc Pro B50 + Custom single slot cooler
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CPU: 13900k
MOTHERBOARD: ASUS Z790-AYW V2
PSU: Cybercore Platinum 1300w
GPU: Sapphire 9070xt nitro +
CASE: Corsair 7000D Airflow
KEYBOARD: Redragon K724 PRO Wireless
MOUSE: ATTACK SHARK R5Ultra 8K Carbon Fiber Wireless
MONITOR: Cx48 Oled and Quest 2 VR
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