Intel is proposing a three-board modular framework for modular laptops and PCs

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Gurpreet Sandhu, Vice President, Platform Engineering Group, Reshma PP, Director System Design, Platform Engineering Group and Roberta Zouain, Sustainability Product Strategy & Marketing Manager, Client Segments have detailed a three board laptop design that maximizes PCB Panel utilization, reduces PCB waste and supports different system configurations with minimal modifications. This supports standardised modules like M.2 SSDs and Core Board, users can effortlessly enhance their storage, and upgrade the system with next-generation processors.

The modular design streamlines the repair process and contributes to the right-to-repair initiative allowing for the replacement of specific damaged parts and IO without the need to discard the entire motherboard. The creation of universal I/O boards (left and right I/O boards) that can be used across various platforms or market segments, which includes all types of laptops but also desktop PCs.

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Thunderbolt, USB-C interfaces for repairable computers ...

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Intel is proposing a three-board modular framework for modular laptops and PCs using the Thunderbolt protocol over USB-C connectors.

 

 

 

 

 

Framework here as an example :