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Sony publishes the first teardown video of PlayStation 5


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Folding@Home Staff
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Sony finally showcased the internal design of its next-generation gaming console. Many interesting details were confirmed by the video posted by Sony. The console will feature liquid metal on its system on a chip, for which Sony spent two years developing the mechanism to apply.

 

The console has two white plastic covers that can be removed by users themselves. The console has built-in dust filters that should make the cleaning process a lot faster. The video also showcases the design of the PCB, featuring AMD Zen2/RDNA2 SoC, custom 825GB SSD and additional 8GB of GDDR6 memory.

 

The console is cooled down by a 45mm thick and 120mm side fan, which is a dual-intake design. The fan is attached to a massive heatsink, which is not a vapor chamber design. Size-wise it does however take a big portion of the console. Sony also confirmed that the power supply is rated at 350W, but no details were revealed as to actual power consumption during normal use.

 

image.thumb.png.9fe20e3bb743540141ac584798695895.png

 

Source

 

 

That heatsink + Liquid Metal is quite nice.

 

Also that large black plastic skeleton/air diverter looks nice and durable too adding some good strength to the structure.  That added strength is almost wasted though as gone are the days of bringing your console to a buddy's house or to camp because this console is huge and has some pretty high power draw.

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Folding@Home Staff
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35 minutes ago, Huzzug said:

Going liquid metal with that big of a heatsink and the power supply makes me think that Navi too is going to be a power hog. 

 

Maybe we'll see. 

 

I'm going to guestimate ~200W under continuous gaming loads with peaks up to ~275W.  The 350W brick might have just been the next option up.  I can't see Sony wasting R&D budget on the Power Supply and would instead source an ODM for that and looking at Laptop power bricks for rough sizes, my 240W Dell power supply is the largest I've seen so 350W might just be the next size that makes sense to design and build at scale to help save money by an ODM.  It also helps that it would have a larger safety margin when the power brick gets inevitably thrown behind the entertainment unit along with all the other cables and power bricks.

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33 minutes ago, axipher said:

 

I'm going to guestimate ~200W under continuous gaming loads with peaks up to ~275W.  The 350W brick might have just been the next option up.  I can't see Sony wasting R&D budget on the Power Supply and would instead source an ODM for that and looking at Laptop power bricks for rough sizes, my 240W Dell power supply is the largest I've seen so 350W might just be the next size that makes sense to design and build at scale to help save money by an ODM.  It also helps that it would have a larger safety margin when the power brick gets inevitably thrown behind the entertainment unit along with all the other cables and power bricks.

I made the statement taking into account Sony's decision to use an expensive TIM solution, a large heatsink and a PSU that big and how the performance and power consumption will translate to desktop cards, as the consoles are designed with performance metric first. 

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Once again once the console is apart, it doesn't exactly look special but neither did any of the predecessors. Amazing what they pack onto one board these days. Nice to see they have gone for what looks like a decent cooling solution (time will tell) so bravo for that.

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Very interesting to see a console that big, but I guess they really are just SFF computers.

 

I'm not that well versed on Liquid Metal. What are the long-term effects of its use?

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