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DRAM Calculator for Ryzen ( news and discussions )


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Below is a list of technical terms relevant to overclocking the memory of a Ryzen-powered machine. Ryzen uses the industry-standard DDR4 memory architecture, so you may be familiar with some of these terms. Some other terms are new and specific to the "Zen" architecture.

  • SOC voltage - system on a chip voltage; responsible for the voltage related to the memory controller.
    Limit: up to 1.2 V.
  • DRAM boot voltage - voltage at which memory training takes place at system start-up.
    Limit: up to 1.45–1.50 V.
  • VDDP voltage - voltage for the transistor that sets memory contents.
    Limit: up to 1.1 V.
  • CLDO VDDP voltage - voltage for the DDR4 PHY on the SoC. The DDR4 PHY or physical-layer interface converts information from the memory controllers to a format the DDR4 memory modules can understand.
    Somewhat counterintuitively, lowering VDDP can often be more beneficial for stability than raising CLDO_VDDP. Advanced overclockers should also know that altering CLDO VDDP can move or resolve memory holes. Small changes to VDDP can have a big effect, and VDDP cannot not be set to a value greater than VDIMM - 0.1 V (not to exceed 1.05 V). A cold reboot is required if you alter this voltage.
    Limit: up to 1.0 V.
  • VPP (VPPM) voltage - voltage that determines how reliably a DRAM row gets accessed.
    Limit: up to 2.7 V.
  • Vref voltage - memory reference voltage; "Configures" both the CPU and the memory module with the voltage level that separates what is to be considered a "0" or a "1"; i.e., voltages found on the memory bus below MEMVREF are to be considered a "0," and voltages above this level are to be considered a "1." By default, this voltage level is half of VDDIO (a.k.a. 0.500x). Some motherboards allow the user to change this ratio, usually through two options: (1) "DRAM Ctrl Ref Voltage" (for the control lines from the memory bus; JEDEC's official name for this voltage is VREFCA), and (2) "DRAM Ctrl Data Ref Voltage" (for the data lines from the memory bus; JEDEC's official name is "VREFDQ"). These options are configured as a multiplier.
  • VTT DDR voltage - voltage used to control the impedance of the bus in order to achieve the high speed and maintain signal integrity. This is done by resistor parallel termination.
  • PLL (1P8) voltage - This option can be used to stabilize the CPU at high BCLKs.
    Limit: up to 1.9 V.
  • CAD_BUS - Command & Address bus; for those who are able to train the memory at high speeds (>=3466MHz), but are unable to stabilize it due to signaling issues. I suggest you try decreasing "Command & Address" related drive currents (increasing the resistance).
    Limit: None.
  • CAD_BUS timings - transceiver delay. Values set a bit mask.
    Limit: None.
  • procODT - resistance value, in ohms, that determines how a completed memory signal is terminated. Higher values can help stabilize higher data rates.
    Limit: None.
  • RTT (Signal Integrity Optimizations) - the use of multiple ranks of DRAM on the DDR4 interface requires additional options for selecting the on-die terminating resistance for individual ranks.
    DDR4 DRAM offers a range of terminating resistance values. The specific DQ pin receiver resistance presented to the interface is selected by a combination of the initial chip configuration and the DRAM operating command if dynamic on-die termination is enabled.
    Limit: None.
  • Geardown Mode - allows the DRAM device to run off its internally-generated ½ rate clock for latching on the command or address buses.
    ON is the default for speeds greater than DDR4-2667. However, the benefit of ON vs. OFF will vary from memory kit to memory kit. Enabling Geardown Mode will override your current command rate.
  • Power Down Mode - can modestly save system power at the expense of higher DRAM latency by putting DRAM into a quiescent state after a period of inactivity.

 

Source: https://www.techpowerup.com/review/a...g-guide/2.html

 

I have always adjusted the CLDO VDDP as per what the calculator recommends, never had an issue thus far. It is an important element in the memory OC as per the definition above. Not adjusting it could result in instability. However that being said, feel free to do your own testing. If you are 100% stable without altering it then that is fine, if not then consider altering it as per the calculator or do some research to backup what the calculator is suggesting. What I know is that I have skipped that step before and my OC was stable, so had to go back and change it to the calcs recommendation, but that is just my experience.

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CPU: Intel Core i5 8500
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CPU: 2 x Xeon|E5-2696-V4 (44C/88T)
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Honestly i'm stable with 1.7.0 settings on Micron E-Die 3400 fast but with every other setting on the latest versions i'm not. Taiphoon reports the kit as A1 PCB 10 layers ( BLS8G4D30AESBK.M8FE by Crucial, Micron E-Die ) 2x8GB. Voltage seems a bit low (1.350 for 3400 while 1.7.0 reports 1.390)

Edited by JAngel
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Hopefully @1usmus will be able to look into this and chime in as well.

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CPU: Intel Core i5 8500
RAM: 16GB (2x8GB) Kingston 2666Mhz
SSD/NVME: 256GB Samsung NVMe
NETWORK: HP 561T 10Gbe (Intel X540 T2)
MOTHERBOARD: Proprietry
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GPU: Nvidia Quadro P2200
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Is there support for 4600mhz kits or am I just doing something wrong? MSI x570 ACE and Corsair vengance lpx 4600 CMK16GX4M2K4600C19

 

yes, Samsung B-die, A3/A2 mode

 

Honestly i'm stable with 1.7.0 settings on Micron E-Die 3400 fast but with every other setting on the latest versions i'm not. Taiphoon reports the kit as A1 PCB 10 layers ( BLS8G4D30AESBK.M8FE by Crucial, Micron E-Die ) 2x8GB. Voltage seems a bit low (1.350 for 3400 while 1.7.0 reports 1.390)

 

At the moment Taiphoon very rarely recognizes the correct information for many reasons. I don't advise you to be guided by it; PCB RAM evaluation can be done visually.

Indeed, the voltage recommendation has become lower, but it should be enough with a reserve.

 

In any case, the voltage can vary greatly from sample to sample. And so there are special cases, which will be quite rare. Are the new recommendations not working for you? Try presets from E-die + A0.

Edited by 1usmus
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Thank you for your answer 1usmus, appreciate it :)

 

Taiphoon reports A1 10 layers while when I opened my kit I experienced A2 PCB layout (single sided 4 and 4 chips). I tried 1.7.3 with A0 E-Die with all the voltage recommendations and while it'll boot TM5 will reports errors in like 3', maybe cause agesa 1.0.0.4 patch B?

 

Also according to Taiphoon it's: [TABLE=align: center, cellpadding: 0, cellspacing: 0]

[TR=bgcolor: #e6e6e6]

[TD]MT40A1G8SA-075:E[/TD]

[/TR]

[/TABLE]

 

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Hi folks, hi 1usmus!

 

I really appreciate the knowledge & tools you provide to those willing to learn everything bout tweaking & configuring their builds - thanx 4 that!

 

After a decade stickin to Intel (mainly Xeon) workstations I recently built my first personal Threadripper 3960x (on ASRock TRX40 Creator) based Workstation! And absolutely I love it - especially beeing able to oc and configure all those parameters locked on Xeons.. ? CPU-tweaking in conjunction with 1usmus' genius Universal PowerPlan works like a charm, BUT I'm really stuck in terms of my DRAM OC-cfg! Does anybody have any experiences with overclocking 2666 M-Die ECC RAM (in my case it's 4 modules 32GB Samsung M391A4G43MB1-CTD which are dual ranked)?

 

Unfortunately these DIMMs are rather rare and therfore not featured by the fantastic DRAM Calculator from 1usmus ...I am searching the web for days now and didn't even find one single post on M-Die behaviour, timings whatsoever :-( I came across buildzoid's vids where he's 'time lapse style' OCing the NON-ECC brother of this RAM, but honestly, when I try imitating buildzoids approaches with my ECC version I will just end up resetting cmos at certain point ...do you have any advice what are the most adequate settings I could feed into the DRAM Calculator in order to get a basic set of timings I could start off with?

 

help would be highly appreciated! thanx in advance!!

 

typhoonReport_Samsung__20M391A4G43MB1-CTD.pdf

M391A4G43MB1-CTD00.pdf

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  • 2 weeks later...

Loving all the new changes, previously my G.Skill F4-3600C18D-16GTZRX didn't like the recommended timings.

 

If anyone is curious the F4-3600C18D-16GTZRX / F4-3600C18D-8GTZRX are definitely PCB Revision A2; I decided to pull one of the ram sticks and look at the underside, the memory chips are in 2 groups of 4 at the ends of the PCB.

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  • 2 weeks later...

I just downloaded 1.7.3, coming from 1.6.2, so I have a few questions. I've got 2 sticks of 16G dual-rank Micron E-die (Thaiphoon report).

  • How do I determine the PCB layout for dual-rank e-die? I found https://www.reddit.com/r/overclocking/wiki/ram/ddr4 which is helpful for single-rank modules but haven't found anyone discussing dual-rank.
  • The calculator will only give me CL16 options, but I'm interested in trying to get 3600 CL14. I haven't had much luck so far, so the reason may be it's not possible.
  • GDM is always shown as enabled in the calculator now? I can get my system stable at 3600 with GDM disabled pretty easily and it gives a nice decrease to latency, so why the change?

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hello and thank you for this useful software. I wanted to ask since I use version 1.62 and I calculated the trfc 2 and trfc 4 based on the data of trfc ns that it gave me using the r-xmp button. now in the new version there is no longer that button so I don't know how to take the trfc ns to calculate the trfc 2 and 4. I would like to understand if those values are no longer needed and I have to leave them on auto or do I have to do something else? I'm noob please don't hit me! lol

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Which memory type and DRAM PCB revision should i choose? I thought it's Micron B-die A0 but when i choose it and click "Calculate FAST" it says "Coming soon!". What should i do?

 

Prepared by Thaiphoon Burner Super Blaster

-------------------------------------------------------------

MEMORY MODULE

-------------------------------------------------------------

Manufacturer : Corsair

Series : Vengeance LPX

Part Number : CMK16GX4M2D3000C16

Serial Number : Undefined

JEDEC DIMM Label : 8GB 1Rx8 PC4-2133P-UA0-10

Architecture : DDR4 SDRAM UDIMM

Speed Grade : DDR4-2133P downbin

Capacity : 8 GB (8 components)

Organization : 1024M x64 (1 rank)

Register Manufacturer : N/A

Register Model : N/A

Manufacturing Date : Undefined

Manufacturing Location : Taiwan

Revision / Raw Card : 0000h / A0 (8 layers)

-------------------------------------------------------------

DRAM COMPONENTS

-------------------------------------------------------------

Manufacturer : Micron Technology

Part Number : D9TBH (MT40A1G8WE-083E:B)

Package : Standard Monolithic 78-ball FBGA

Die Density / Count : 8 Gb B-die (Z01A / 20 nm) / 1 die

Composition : 1024Mb x8 (64Mb x8 x 16 banks)

Input Clock Frequency : 1067 MHz (0,938 ns)

Minimum Timing Delays : 15-15-15-36-50

Read Latencies Supported : 24T, 23T, 22T, 21T, 20T, 19T, 18T...

Supply Voltage : 1,20 V

XMP Certified : 1499 MHz / 16-20-20-38-58 / 1,35 V

XMP Extreme : Not programmed

SPD Revision : 1.0 / January 2014

XMP Revision : 2.0 / December 2013

-------------------------------------------------------------

SOURCE SPD DUMP

-------------------------------------------------------------

000 23 10 0C 02 85 21 00 08 00 00 00 03 01 03 00 00

010 00 00 08 0C FF FF 03 00 6C 6C 6C 11 08 74 F0 0A

020 20 08 00 05 00 A8 1E 2B 2B 00 00 00 00 00 00 00

030 00 00 00 00 00 00 00 00 00 00 00 00 16 36 16 36

040 16 36 16 36 00 00 2B 0C 2B 0C 2B 0C 2B 0C 00 00

050 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

060 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

070 00 00 00 00 00 ED B5 CE 00 00 00 00 00 C2 B6 0D

080 11 11 00 00 00 00 00 00 00 00 00 00 00 00 00 00

090 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

0A0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

0B0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

0C0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

0D0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

0E0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

0F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 B6 58

100 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

110 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

120 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

130 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

140 02 9E 00 00 00 00 00 00 00 43 4D 4B 31 36 47 58

150 34 4D 32 44 33 30 30 30 43 31 36 20 20 00 80 2C

160 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

170 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

180 0C 4A 01 20 00 00 00 00 00 A3 00 00 06 FF FF 03

190 00 56 6B 6B 10 CA 36 F0 0A 20 08 00 05 00 B0 21

1A0 2B 00 00 00 00 00 00 00 00 D9 85 C0 DD DD B2 AD

1B0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

1C0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

1D0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

1E0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

1F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

 

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@1usmus

hello i have a problem

 

ryzen 3600 mobo b450

ram: tridentz rgb 2x8 3200mhz cl16

 

hynix A-die (AFR)

when I try calculate to 3600 have error "not supported" but lower mhz ( 3466 and lower working) so why 3600mhz calculate doesnt work?

 

actually ram working 3600mhz cl 16 19 19 85 but i want to calculate lower timings

 

 

ae1007d4b4228b2emed.png

Edited by kacpi619
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Which memory type and DRAM PCB revision should i choose? I thought it's Micron B-die A0 but when i choose it and click "Calculate FAST" it says "Coming soon!". What should i do?

 

Prepared by Thaiphoon Burner Super Blaster

-------------------------------------------------------------

MEMORY MODULE

-------------------------------------------------------------

Manufacturer : Corsair

Series : Vengeance LPX

Part Number : CMK16GX4M2D3000C16

Serial Number : Undefined

JEDEC DIMM Label : 8GB 1Rx8 PC4-2133P-UA0-10

Architecture : DDR4 SDRAM UDIMM

Speed Grade : DDR4-2133P downbin

Capacity : 8 GB (8 components)

Organization : 1024M x64 (1 rank)

Register Manufacturer : N/A

Register Model : N/A

Manufacturing Date : Undefined

Manufacturing Location : Taiwan

Revision / Raw Card : 0000h / A0 (8 layers)

-------------------------------------------------------------

DRAM COMPONENTS

-------------------------------------------------------------

Manufacturer : Micron Technology

Part Number : D9TBH (MT40A1G8WE-083E:B)

Package : Standard Monolithic 78-ball FBGA

Die Density / Count : 8 Gb B-die (Z01A / 20 nm) / 1 die

Composition : 1024Mb x8 (64Mb x8 x 16 banks)

Input Clock Frequency : 1067 MHz (0,938 ns)

Minimum Timing Delays : 15-15-15-36-50

Read Latencies Supported : 24T, 23T, 22T, 21T, 20T, 19T, 18T...

Supply Voltage : 1,20 V

XMP Certified : 1499 MHz / 16-20-20-38-58 / 1,35 V

XMP Extreme : Not programmed

SPD Revision : 1.0 / January 2014

XMP Revision : 2.0 / December 2013

-------------------------------------------------------------

SOURCE SPD DUMP

-------------------------------------------------------------

000 23 10 0C 02 85 21 00 08 00 00 00 03 01 03 00 00

010 00 00 08 0C FF FF 03 00 6C 6C 6C 11 08 74 F0 0A

020 20 08 00 05 00 A8 1E 2B 2B 00 00 00 00 00 00 00

030 00 00 00 00 00 00 00 00 00 00 00 00 16 36 16 36

040 16 36 16 36 00 00 2B 0C 2B 0C 2B 0C 2B 0C 00 00

050 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

060 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

070 00 00 00 00 00 ED B5 CE 00 00 00 00 00 C2 B6 0D

080 11 11 00 00 00 00 00 00 00 00 00 00 00 00 00 00

090 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

0A0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

0B0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

0C0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

0D0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

0E0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

0F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 B6 58

100 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

110 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

120 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

130 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

140 02 9E 00 00 00 00 00 00 00 43 4D 4B 31 36 47 58

150 34 4D 32 44 33 30 30 30 43 31 36 20 20 00 80 2C

160 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

170 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

180 0C 4A 01 20 00 00 00 00 00 A3 00 00 06 FF FF 03

190 00 56 6B 6B 10 CA 36 F0 0A 20 08 00 05 00 B0 21

1A0 2B 00 00 00 00 00 00 00 00 D9 85 C0 DD DD B2 AD

1B0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

1C0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

1D0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

1E0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

1F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

 

Have you tried using a different memory revision such as the A3/A2/B2 dropdown to see what results you get if any ?

 

hello i have a problem

 

ryzen 3600 mobo b450

ram: tridentz rgb 2x8 3200mhz cl16

 

hynix A-die (AFR)

when I try calculate to 3600 have error "not supported" but lower mhz ( 3466 and lower working) so why 3600mhz calculate doesnt work?

 

actually ram working 3600mhz cl 16 19 19 85 but i want to calculate lower timings

 

 

ae1007d4b4228b2emed.png

 

Possibly a bug @1usmus any idea ?

 

 

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CPU: Intel Core i5 8500
RAM: 16GB (2x8GB) Kingston 2666Mhz
SSD/NVME: 256GB Samsung NVMe
NETWORK: HP 561T 10Gbe (Intel X540 T2)
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CPU: 2 x Xeon|E5-2696-V4 (44C/88T)
RAM: 128GB|16 x 8GB - DDR4 2400MHz (2Rx8)
MOTHERBOARD: HP Z840|Intel C612 Chipset
GPU: Nvidia Quadro P2200
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SSD/NVME: Intel 512GB 670p NVMe (Main OS)
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Have you tried using a different memory revision such as the A3/A2/B2 dropdown to see what results you get if any ?

 

 

 

Possibly a bug @1usmus any idea ?

 

 

Yes i tried and it didn't make a difference. The "Calculate SAFE" option does work though.

 

Another thing i want to ask is that in the past i could have SWORN Thaiphoon Burner showed i have a Samsung die chip but now it says Micron die for some reason. What does this mean? Could i somehow saw it wrong?

 

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Yes i tried and it didn't make a difference. The "Calculate SAFE" option does work though.

 

Another thing i want to ask is that in the past i could have SWORN Thaiphoon Burner showed i have a Samsung die chip but now it says Micron die for some reason. What does this mean? Could i somehow saw it wrong?

 

Will have to wait for @1usmus to chime in on that one. As for Thaiphoon Burner, either you read it wrong or something has changed between one software version to another regarding its detection maybe ? Only way to test is to get an older version of the software and test it against your current version and see if it comes up as a different value.

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SSD/NVME: Intel 512GB 670p NVMe (Main OS)
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Hey everyone, new to the site and trying to overclock ram on Ryzen and really need some help. Current setup is

 

MSI Creator TRX40

Threadripper 3970x

G.Skill 128gb (8x16) 14-14-14-34.

 

System is watercooled and cpu temps are great. This system is mainly for work but I do game a tiny bit so want to get more performance. I was using a 64gb Corsair CL19@3600 kit but while working I could easily hit the 64 gigs and decided to upgrade to a better kit. I've been trying to just get a simple 3600 oc running but I can not get the system to post for the life of me.

 

Memory report from Thaiphoon

phSREQb.png

 

Timings I'm attempting

omAVF9a.png

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Hey everyone, new to the site and trying to overclock ram on Ryzen and really need some help. Current setup is

 

MSI Creator TRX40

Threadripper 3970x

G.Skill 128gb (8x16) 14-14-14-34.

 

System is watercooled and cpu temps are great. This system is mainly for work but I do game a tiny bit so want to get more performance. I was using a 64gb Corsair CL19@3600 kit but while working I could easily hit the 64 gigs and decided to upgrade to a better kit. I've been trying to just get a simple 3600 oc running but I can not get the system to post for the life of me.

 

Memory report from Thaiphoon

phSREQb.png

 

Timings I'm attempting

omAVF9a.png

 

Have you tried changing your Ram Type to A3/A2 category ? I believe your kit should be in this category. This will influence what the calculator outputs. I have the same kit, all be it the 32GB Variant and I can hit over 3600Mhz. (This is a 4x 8GB Module kit). I do know that as the memory count goes up, it can hamper the overall speeds you can achieve. Can you attain a lower speed setting ? Have you tried looser timings ?

 

The calculator is great, but also a guideline at times and what it gives out does not guarantee 100% compatibility. If 3600Mhz does not work on the tighter timings, loosen them up. If that does not work then keep the looser timings but also reduce the ram clock until you get stability. Once you know you are stable, you can revisit the timings again,

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CPU: Intel Core i5 8500
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CPU: 2 x Xeon|E5-2696-V4 (44C/88T)
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I did try that and it just fails, this is the current oc I am able to run. nullnull

 

cKvoctE.png

 

So I notice a few things right now.

 

1. You are using the Fast preset on the calculator, do you fair better at a higher clock rate say 3600Mhz but on the Safe preset ? Fastest is nice but not always going to work out, so sometimes you have to fallback to safe, but in all honesty the timings still stay fairly tight.

 

2. I notice your memory rank is set to 2. Are you sure your kit is dual ranked ? This plays a part in outputting the correct settings. I ironically had mine set to dual by accident and could never get my OC stable, as soon as I went to single ranked (Which my ram is) I was able to get the OC stable.

 

3. Do yourself a favour and in the voltage section of the calculator, set all your voltages to maximum in the BIOS. Once you are stable you can revisit the voltages and reduce them later if you want, but we might as well just remove that as a factor straight away.

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CPU: AMD Ryzen 9 7950X3D
MOTHERBOARD: MSI Meg Ace X670E
RAM: Corsair Dominator Titanium 64GB (6000MT/s)
GPU: EVGA 3090 FTW Ultra Gaming
SSD/NVME: Corsair MP700 Pro SE Gen 5 4TB
PSU: EVGA Supernova T2 1600Watt
CASE: be quiet Dark Base Pro 900 Rev 2
FANS: Noctua NF-A14 industrialPPC x 6
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CPU: Intel Core i5 8500
RAM: 16GB (2x8GB) Kingston 2666Mhz
SSD/NVME: 256GB Samsung NVMe
NETWORK: HP 561T 10Gbe (Intel X540 T2)
MOTHERBOARD: Proprietry
GPU: Intel UHD Graphics 630
PSU: 90Watt
CASE: HP EliteDesk 800 G4 SFF
Full Rig Info

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CPU: 2 x Xeon|E5-2696-V4 (44C/88T)
RAM: 128GB|16 x 8GB - DDR4 2400MHz (2Rx8)
MOTHERBOARD: HP Z840|Intel C612 Chipset
GPU: Nvidia Quadro P2200
HDD: 4x 16TB Toshiba MG08ACA16TE Enterprise
SSD/NVME: Intel 512GB 670p NVMe (Main OS)
SSD/NVME 2: 2x WD RED 1TB NVMe (VM's)
SSD/NVME 3: 2x Seagate FireCuda 1TB SSD's (Apps)
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