pc gamer AMD talks about its upcoming 3D V-Cache design at ISSCC

[ENTERPRISE]

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AMD has teased its 3D V-Cache technology for several months, culminating in the reveal of the Ryzen 7 5800X3D at the company’s CES 2022 keynote back in early January. Fast forward to today, and AMD has revealed some further technical details behind its design at the International Solid-State Circuits Conference (via Hardwareluxx).

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[ArchStanton]

I have no plans to obtain a 5800X3D, but I've always been interested in the concept.  Given that "over-cooling" Zen3 is the easiest way to overclock it, I have always been concerned about the ability of the chiplets to dissipate heat through an additional "layer".  The article seems to indicate that there are some hurdles that have not been overcome on this frontier.  It will be interesting to see the true performance measurements once the CPU is placed in the hands of independent reviewers.

[ENTERPRISE]

  On 24/02/2022 at 18:29, ArchStanton said:

I have no plans to obtain a 5800X3D, but I've always been interested in the concept.  Given that "over-cooling" Zen3 is the easiest way to overclock it, I have always been concerned about the ability of the chiplets to dissipate heat through an additional "layer".  The article seems to indicate that there are some hurdles that have not been overcome on this frontier.  It will be interesting to see the true performance measurements once the CPU is placed in the hands of independent reviewers.

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I would have been interested in the 3D versions if they had not been released so close to the end of AM4.

[ozlay]

I wonder if they can adapt the same 3D V-Cache design to Zen4. Zen4 being 5nm might require them to move the traces between the 2 layers.

[Sir Beregond]

  On 24/02/2022 at 18:29, ArchStanton said:

I have no plans to obtain a 5800X3D, but I've always been interested in the concept.  Given that "over-cooling" Zen3 is the easiest way to overclock it, I have always been concerned about the ability of the chiplets to dissipate heat through an additional "layer".  The article seems to indicate that there are some hurdles that have not been overcome on this frontier.  It will be interesting to see the true performance measurements once the CPU is placed in the hands of independent reviewers.

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I thought about waiting, but ultimately, I share the same concerns over the heat dissipation and frankly I wanted a 5900X version.